StarRC is a parasitic extraction tool used to model resistance, capacitance, and inductance in semiconductor interconnects. It supports accurate analysis for timing, signal integrity, and power verification across advanced process nodes. It helps teams capture layout-dependent effects before signoff and improves confidence in post-layout analysis
StarRC Key Capabilities
- High-Accuracy Parasitic Extraction – Provides silicon-accurate modeling of interconnect parasitics, including resistance, capacitance, and inductance.
- Advanced Process Modeling – Supports FinFET, multi-patterning, and other advanced node effects with detailed physical modeling.
- Embedded 3D Field Solver (Rapid3D) – Includes high-precision field solver support for critical nets and complex structures.
- Multi-Core Distributed Processing – Uses scalable multi-core computation for high-performance extraction across large designs.
- Simultaneous Multi-Corner Extraction (SMC) – Processes multiple extraction corners in a single run to reduce runtime and disk usage.
- Fast ECO Extraction – Extracts only modified regions for faster design iteration during ECO cycles.
- Inductance Extraction for High-Speed Designs – Models inductive effects in clock networks and high-frequency interconnects.
- 3DIC and Advanced Packaging Support – Handles TSVs, interposers, and stacked die configurations for advanced packaging flows.
Why StarRC is Used?
StarRC used to accurately capture parasitic effects because it:
- Ensures signoff-level accuracy for timing and noise analysis
- Improves reliability by modeling real interconnect behavior
- Reduces design iterations through precise extraction results
- Supports advanced nodes with complex parasitic effects
- Enables efficient analysis across multiple process corners
Where StarRC is Used?
- Full-chip and block-level parasitic extraction for SoC and ASIC designs
- Analog and mixed-signal (AMS) circuit analysis
- Timing, signal integrity, and power analysis workflows
- High-speed digital and RF circuit design
- 3DIC and advanced packaging design environments
StarRC Integration with Other Tools
- IC Compiler II and Fusion Compiler for implementation workflows
- PrimeTime for static timing analysis using extracted parasitics
- PrimeSIM for circuit simulation and reliability analysis
- IC Validator for physical verification flows
- Custom Compiler and third-party design environments for custom design flows
Looking to evaluate StarRC for your next project?
Our experts can help you explore how StarRC fits your design and simulation needs.
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